- Time： 2024/1/2 Posted： Kingtech Semi (Shenzhen) Co., Ltd
- With the continuous development of society, the rapid development of microelectronics, electronic computer technology, modern communication technology, optoelectronics technology, and space technology has put forward new requirements for relay technology. The development of new processes and technologies undoubtedly plays a role in the development of relay technology.
The rapid development of microelectronics technology and ultra large scale ICs has also put forward new requirements for relays. The first is miniaturization and flaking. Military TO-5 with IC packaging (8.5) × eight point five × 7.0mm relay, which has high vibration resistance, can make the equipment more reliable; The second is combination and multifunctionality, which can be compatible with ICs, can have built-in amplifiers, and requires sensitivity to be increased to the micro watt level; The third is full solidification. Solid state relays have high sensitivity and can prevent electromagnetic interference and radio frequency interference.
The popularization of computer technology has significantly increased the demand for relays for microcomputers, and relays with microprocessors will develop rapidly. In the early 1980s, digital time relays produced in the United States could be controlled by commands. The combination of relays and microprocessors developed to form a compact and sophisticated control system. Industrial robots controlled by computers are currently growing at a rate of 3.5% per year. Nowadays, computer controlled production systems can produce various low-cost relays on a single production line and can automatically complete various operations and testing tasks
Optoelectronic technology will have a huge promoting effect on relay technology. In order to achieve reliable operation of optical computers, bistable relays have been developed.In order to improve the reliability of aviation and aerospace relays, it is expected that the failure rate of relays should be reduced from the current 0.1PPM to 0.01PPM; The manned space station requires a capacity of 0.001 PPM. The temperature resistance should reach 200 ℃ or above, the vibration resistance requirement should be higher than 490m/s, and it should be able to withstand 2.32 × 10 (4) C/Kg α Radiation from radiation. To meet space requirements, it is necessary to strengthen reliability research and establish specialized high reliability production lines.
The development of new special structural materials, new molecular materials, high-performance composite materials, optoelectronic materials, as well as oxygen absorbing magnetic materials, temperature sensing magnetic materials, and amorphous soft magnetic materials, is of great significance for the development of new magnetic retention relays, temperature relays, and electromagnetic relays, and new principles and effects of relays will inevitably emerge.
With the improvement of miniaturization and chip technology. The relay will develop towards miniaturization and surface mount with only a few millimeters in two-dimensional and three-dimensional dimensions; Currently, some international manufacturers produce relays with a volume of only 1/4 to 1/8 of that of 5-10 years ago. Because electronic devices require smaller relays that do not exceed the height of other electronic components when reducing volume. Communication equipment manufacturers have a more urgent demand for dense relays, and a BA series ultra dense signal relay produced by Fujitsu Takamisawa in Japan has a size of only 14.9 (W) × 7.4 (D) × 9.7 (H) mm, mainly used for fax machines and modems, capable of withstanding fluctuating voltages of 3kV. The volume of the AS series surface mounted relays launched by the company is only 14 (W) × 9 (D) × 6.5 (H) mm.
In the future, the focus of market development for small sealed relays will be on TO-5 relays compatible with ICs and 1/2 crystal cover relays. Military relays will accelerate their transition to industry/commercialization. US military relays account for approximately 20% of the total relay value. The general relay market continues to develop towards small, thin, and plastic packaging. Miniature printed circuit board relays will continue to be the mainstream product in the development of the general relay market. Solid state relays will become more widespread, and prices will continue to decline, approaching high reliability, small size, high resistance to surge current impact, and anti-interference performance. The tongue spring relay market will continue to expand. The application fields and demand for surface mounted relays will be on the rise. Electronic components will undoubtedly have a very good development prospect in the future
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